Msl Level 3 Shelf Life

Understand handling and packaging.

Msl level 3 shelf life.

36 months at 40 c and 90 relative humidity rh 2. The classification of moisture sensitive components is outlined in the ipc specification j std 20. In case thedevice is qualified according to fujitsu msl level the conditions are listed in. The msl is an electronic standard for the time period in which a moisture sensitive device can be exposed to ambient room conditions 30 c 85 rh at level 1.

Or in case the device msl level is classified according to jedec j std 020c the related floor life can be seen below. All allegro packages whether smd or not have a minimum shelf life of 5 years. Increasingly semiconductors have been manufactured in smaller sizes. Modules are rated msl 3.

If you have any questions regarding this statement. For connector products stored at harwin at the end of the 3 year shelf life any components that have not been sold are destroyed and responsibly recycled. Below is a basic chart which defines moisture exposures applicable to surface mount device smd packages. Management of moisture sensitive devices begins with understanding each devices level of sensitivity.

Msl 1 2 3 rating and peak reflow labeling examples on cardboard box 2 applying the moisture sensitivity level msl the msl rating of an ic determines its floor life before board mounting after the drypack packing msl2. 30 c 60 rh at all other levels. When the moisture sensitive bag is opened the flo life will start.

It is recommended that shelf life should not exceed 12 months at 40ºc and 90 rh. The moisture sensitivity level msl indicates the floor life of the component its storage conditions and handling precautions after the original container has been opened. 2 3 floor life and msl level. Moisture caution label msl 3 3 caution this bag contains moisture sensitive devices 1.

Moisture sensitivity level msl. Shelf life in sealed bag. Moisture sensitivity level relates to the packaging and handling precautions for some semiconductors. The permissible time from opening the moisture barrier bag until the final soldering process that a component can remain outside the moisture barrier bag is a measure of.

After this bag is opened devices that will be subjected to convection reflow or equivalent processing peak package body temperature of 220 c must be.